Static electricity from inside the human body, the environment, and even electronic devices can cause various damage to delicate semiconductor chips, such as penetrating a thin insulating layer inside the component; damaging the gates of MOSFETs and CMOS components; and flip-flops in CMOS devices Short-circuit reversed PN junction; short-circuit forward-biased PN junction; melting of the weld line or aluminum wire inside the active device. In order to eliminate the interference and destruction of electronic devices by electrostatic discharge (ESD), various technical means are needed to prevent them.
In the design of the PCB board, the anti-ESD design of the PCB can be realized by layering, proper layout and installation. In the design process, most of the design modifications can be limited to increasing or decreasing components through prediction. ESD can be well protected by adjusting the PCB layout.